Semiconductor Substrate Product List and Ranking from 4 Manufacturers, Suppliers and Companies

Power semiconductor substrate (DCB)

Over 10 years of manufacturing experience for substrates for thermoelectric modules (Peltier elements). For power devices, solid-state relays (SSR), and more!

This is an insulating substrate for heat dissipation, which has a copper circuit board bonded to an alumina ceramic substrate using the DCB (Direct Copper Bond) method. *DCB (Direct Copper Bond) method refers to the technique of bonding a copper circuit board to a ceramic substrate through eutectic reaction. **Features** - Over 10 years of manufacturing experience for substrates used in thermoelectric modules (Peltier elements). - Manufactured at a 100% wholly-owned subsidiary in China. - Options for alumina ceramic white boards from Japan, Germany, or China. - The ceramic substrate can flexibly accommodate various external dimensions through mold processing, laser processing, etc. - The ceramic white board and copper plate are bonded using in-house equipment, and copper plating processes such as etching are applied before shipment. - The surface of the copper circuit can be treated in various ways, including untreated, Ni plating, and Ni + Au plating. *For more details, please contact us or download the PDF.*

Company：フェローテックホールディングス
Price：Other

Printed Circuit Board
Other semiconductors
Semiconductor Substrate

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[Analysis Case] Measurement of Impurity Concentration on the Surface and Inside of SiC Substrates

Analysis of the substrate surface and interior is separated using ICP-MS and GDMS.

Impurities contained in semiconductor materials can affect product quality, leading to issues such as leakage current and early device failure. Therefore, understanding the amount of impurities in the materials is crucial for improving product quality. This document presents a case study on SiC substrates, which are gaining attention as power device materials, analyzing impurities adhered to the substrate surface using ICP-MS and impurities within the substrate using GDMS. Measurement methods: ICP-MS, GDMS Product fields: Power devices, manufacturing equipment, components Analysis purpose: Trace concentration evaluation For more details, please download the document or contact us.

Company：一般財団法人材料科学技術振興財団　MST
Price：Other

Contract Analysis
Contract measurement
Semiconductor Substrate

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Achieving miniaturization of products and improvement in quality: Development of 0201 integrated semiconductor substrates.

Our technology, which integrates 0201 size chips into semiconductor substrates, expands the possibilities of manufacturing services.

JOHNAN DMS Corporation is jointly developing the "0201 size chip capacitor integrated semiconductor substrate" in collaboration with Taiyoh Printing Circuit Industry Co., Ltd. Using this technology, we provide various services such as the production of PCBs and semiconductor substrates that incorporate 0201 components. We contribute to solving challenges related to high-density mounting, miniaturization of products, and EMC solutions for high-speed transmission of large-capacity data, which are increasingly in demand in recent years. If you are facing issues such as "deterioration of EMC leading to unstable operation during high-speed transmission of large-capacity data," please feel free to contact us. For more details, please refer to the related links.

Company：JOHNAN DMS
Price：Other

Printed Circuit Board
Semiconductor Substrate

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Semiconductor substrate and its manufacturing method, as well as a vapor phase growth apparatus used for it.

Warping caused by differences in physical constants is canceled out between both surfaces! It is possible to manufacture semiconductor substrates with minimal warping!

The issue of warping in GaN substrates leads to high costs due to low yield, as well as low crystal quality and small areas of low quality, which in turn becomes the biggest factor hindering the widespread adoption of GaN substrates. The present invention aims to produce semiconductor substrates with minimal warping using a vapor phase growth method. By alternately growing semiconductor crystals on both sides of the base substrate using the vapor phase growth method, the warping caused by differences in physical constants such as the thermal expansion coefficients of the base substrate and the semiconductor is canceled out between the two sides, making it possible to manufacture semiconductor substrates with minimal warping. 【Key Solutions】 - Manufacturing semiconductor substrates by growing semiconductor crystals on the base substrate using the vapor phase growth method. - A process in which raw gas is brought into contact with one principal surface of the base substrate to grow semiconductor crystals on the base substrate. - Another process in which raw gas is brought into contact with the other principal surface of the base substrate to grow semiconductor crystals on the base substrate. - Alternating between the first process and the other process. *For more details, please refer to the PDF document or feel free to contact us.

Company：山口ティー・エル・オー
Price：Other

Other semiconductors
Semiconductor Substrate

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Semiconductor Substrate Product List and Ranking from 4 Manufacturers, Suppliers and Companies | IPROS GMS